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OPTi series delivers broad compatibility and improved performance across diverse IC packaging applications. Built on the proven ACS foundation, it combines upgraded materials, refined manufacturing, and reliable design principles to provide consistent quality, durability, and efficiency for modern copper wire bonding needs.


The OPTi series is the latest generation of copper wire capillaries designed for a wide range of IC packaging applications.



As an upgraded version of the legacy ACS series, it seamlessly fits within existing ACS and competitor process windows, ensuring smooth integration and enhanced performance.

Proven Advancement

Design evolution

As an upgraded version of the legacy ACS series, OPTi series integrates high-quality PTX ceramics, refined manufacturing processes, and time-tested ACS geometrical design rules. This combination ensures enhanced durability, stability, and bonding precision for copper wire applications.

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