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Quantis™ QFN is the first in the Quantis copper wire bonding capillary series, built on an advanced ceramics composite platform. Combining extensive copper wire bonding experience with engineered geometries to deliver reliable performance. It can handle the toughest process challenges across various QFN carriers.


The RP1™ material sets a new benchmark with the highest micro-structure quality and enhanced resistance to failure.



Its advanced mechanical properties ensure consistent performance across applications, delivering reliability and competitive cost-of-ownership.

Versatile Application

Copper compatibility

  • Quantis™ QFN supports copper wire diameters ranging from 0.7 to 2.5 mil and accommodates any copper wire type.
  • It is suitable for mid pin-count QFNs and QFPs, including their various sub-types.
Reliable Performance

Enhanced material

Built with RP1™ material of superior micro-structure quality. Quantis™ QFN offers greater resistance to failure and improved mechanical consistency for stable bonding performance.

Productivity Advantage

Operational efficiency

  • Enhances process stability with a wider bonding window and consistent capillary response.
  • Its advanced material design reduces tip wear, increases productivity, and delivers more bonds per capillary per hour.
  • Effectively lowering overall cost of ownership.
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