K&S's bond head refurbishment service restores the bonder’s core assembly to peak condition through complete teardown, precise diagnostics, and replacement of worn components. Eliminating chronic issues that degrade bond quality, stabilizes calibration, and extends wedge tool life.


Our routine maintenance effectively addresses signs of gradual bond head deterioration caused by wear and tear:


  • Critical failures - die crack or cratering
  • Compromised bond quality and MTBA - inconsistent bond deformation and frequent non-stick
  • Compromised performance - calibration out of range
Restored Mechanical Precision

Total rebuild of bond head

Complete teardown and expert rebuilding return the bond head to factory-level alignment and accuracy. The result is stable, repeatable bonding performance that protects yield across high-volume production.

Extended Tool Longevity

Lower operational costs

Refurbishment significantly extends wedge tool life multiple folds by eliminating the underlying mechanical degradation that accelerates tool wear. Fewer failures mean fewer stoppages, fewer replacements, and less technician intervention. This drives meaningful cost reduction while improving overall throughput.
Proactive Performance Stability
Ensuring quality output
Every refurbished bond head undergoes the same stringent checks and buy-off procedures as a brand-new machine and bond head. This guarantees that the refurbished bond head meets the same highest standards of quality and performance.
YOU MAY ALSO LIKE

Other products

XYZT Assembly Refurbishment Service
XYZT Assembly Refurbishment Service
Precision-aligned XYZT assembly for peak uptime
PowerFusionâ„¢
PowerFusionâ„¢
High-performance bonding for advanced power devices
Asterion®
Asterion®
Hybrid wedge bonder for advanced interconnect applications
YOU MAY ALSO LIKE

Other content

SEMICON China
SEMICON China
Discover the next generation of advanced packaging and electronics assembly solutions.
SEMICON SEA
SEMICON SEA
SEMICON Southeast Asia has become an important exposition for the electronics industry in Southeast Asia. The show connects the decision makers from the industry, demonstrates the most advanced products, and brings in the most up-to-date market and technology trends.
ECTC
ECTC
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society.
Cookie Settings

We use cookies to provide you the best experience on our website. By accepting this message, you agree to our use of cookies.