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AI-Ex™ is an advanced aluminum wire and ribbon bonding wedge that removes the need for wedge cleaning, instantly boosting uptime, MTBA, and productivity. With plug-and-play compatibility across wire and ribbon applications, AI-Ex™ lowers operational costs, minimizes human error, and simplifies conversion with minimal process changes.


AI-Ex™ introduces a no-clean wedge design enabled by a new surface treatment that reduces surface wettability and slows contamination build-up. This eliminates wedge-cleaning while maintaining longer tool life.



Its plug-and-play compatibility supports easy conversion across large wire, small wire, and ribbon applications with minimal process changes.

Advanced surface treatment technology

No clean wedge

AI-Ex™’s advanced surface treatment reduces wettability and slows contamination build-up, removing the need for wedge cleaning entirely. This allows bonding operations to maintain equal or longer tool life without downtime for maintenance.


Manufacturers gain a cleaner, more stable process that delivers higher productivity with fewer interruptions.

Universal Bonding Flexibility

Plug & play

AI-Ex™ supports large wire, small wire, and ribbon applications. Its geometry-agnostic design enables easy conversion from current wedges with minimal process adjustments.


This flexibility simplifies adoption and accelerates the productivity gains of a no-clean workflow.

Optimized Production Efficiency

More output, less cost

By removing cleaning steps, AI-Ex™ reduces labor dependency, minimizes human error, and increases bonder uptime and OEE. It also lowers chemical usage, consumable wear, and quality risks tied to protrusion buildup.


The result is a more economical, streamlined bonding process that frees space, reduces costs, and supports Industry 4.0 readiness.

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