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AI-Ex™’s advanced surface treatment reduces wettability and slows contamination build-up, removing the need for wedge cleaning entirely. This allows bonding operations to maintain equal or longer tool life without downtime for maintenance.
Manufacturers gain a cleaner, more stable process that delivers higher productivity with fewer interruptions.
AI-Ex™ supports large wire, small wire, and ribbon applications. Its geometry-agnostic design enables easy conversion from current wedges with minimal process adjustments.
This flexibility simplifies adoption and accelerates the productivity gains of a no-clean workflow.
By removing cleaning steps, AI-Ex™ reduces labor dependency, minimizes human error, and increases bonder uptime and OEE. It also lowers chemical usage, consumable wear, and quality risks tied to protrusion buildup.
The result is a more economical, streamlined bonding process that frees space, reduces costs, and supports Industry 4.0 readiness.
