Smarter Dispensing Solutions

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APTURA

K&S’s next generation of TCB solution, the latest APTURA™ series, offers the first-of-its-kind “fluxless bonding”, enabling direct Cu-to-Cu and bumpless bonding. 

Automated Material Handling Systems

K&S partners with AUO Digitech and LeYu Precision to bring proven factory automation solutions for ball bonder production lines, enabling our customers to accelerate the transition to Industry 4.0.

Advanced Dispensing Solutions

High-Speed Precision Dispensing and Coating Applications. 

MAKE YOUR POWER DEVICES MORE POWERFUL THAN EVER!

Kulicke & Soffa's AVALINE™ is the latest clip attach solution engineered to address the growing demand for efficient and reliable power devices in today's challenging electronics sector. 

SECULAR TRENDS PROVIDING ADDITIONAL GROWTH OPPORTUNITIES

Assembly Complexity

Advanced Display Transition

Automotive Revolution

News

Discover recent K&S news and stories.

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Kulicke & Soffa Completes Share Repurchase Program Dec 02, 2024
Kulicke & Soffa Expands Fluxless Thermo-Compression Customer Base Nov 13, 2024
Kulicke & Soffa and ROHM Semiconductor Develop New CuFirst™ Hybrid Bonding Process Nov 13, 2024

Events

See a list of our upcoming trade show and seminar events around the world.

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Tokyo
Big Sight,
Japan
Jan 22 - Jan 24, 2025
Trade Show
Sheraton Grand at Wild Horse Pass,
Phoenix, Arizona,
US
Mar 05 - Mar 06, 2025
Trade Show
Anaheim Convention Center
Anaheim,CA
Mar 18 - Mar 20, 2025
Trade Show

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