With over 40 years of experience, K&S Capillary Consumables is one of the leading players in the semiconductors assembly industry. We develop and manufacture advanced bonding tools ​for a broad range of applications, providing end-to-end solutions to a wide array of customers who are market leaders in their respective fields.

Our product offerings vary from standard designs to customized solutions that address different packaging challenges and application requirements.

Copper capillary for high-pin count and fine pitch, BGA, and PBGA

Copper capillary for mid-pin count QFP, QFN, PPF, and μPPF lead frames

Copper capillary for low-pin count applications, such as discrete and power ICs

Dedicated for advanced memory and logic devices using gold/silver wire

Latest capillary solution for copper wire bonding
Capillary for low-pin count applications such as LED and discrete semiconductors micro-chips

Latest technology for gold wire bonding

Taking looping performance to the next level

Fine and ultra-fine pitch 1st bond reliability

Taking the lead in 2nd bond performance

Tailor-made design for sensitive die structure (Low-k, BOAC) applications

Advanced capillary solution for copper wire bonding

General Inquiries

We are here to help. Please complete the inquiry form and we will direct you to the right team.