With over 40 years of experience, K&S Capillary Consumables is one of the leading players in the semiconductors assembly industry. We develop and manufacture advanced bonding tools ​for a broad range of applications, providing end-to-end solutions to a wide array of customers who are market leaders in their respective fields.

Our product offerings vary from standard designs to customized solutions that address different packaging challenges and application requirements.

K&S Proven Solution for SiP and Memory Packages
The latest series of Copper wire capillary products
Improving Capillary Lifespan and Cost-of-Ownership
Dedicated for advanced memory and logic devices using gold/silver wire

Copper capillary for high-pin count and fine pitch, BGA, and PBGA

Copper capillary for mid-pin count QFP, QFN, PPF, and μPPF lead frames

Copper capillary for low-pin count applications, such as discrete and power ICs

Latest capillary solution for copper wire bonding
Capillary for low-pin count applications such as LED and discrete semiconductors micro-chips
Latest technology for gold wire bonding
Taking looping performance to the next level
Fine and ultra-fine pitch 1st bond reliability
Taking the lead in 2nd bond performance
Tailor-made design for sensitive die structure (Low-k, BOAC) applications
Advanced capillary solution for copper wire bonding

General Inquiries

We are here to help. Please complete the inquiry form and we will direct you to the right team.