Tailor-made design for sensitive die structure

SIGMA II™ is a tailor-made design for Low-k and BOAC applications.
SIGMA II™ Key Attributes:
  • Unique design which enables highly efficient ultrasonic response
  • Enables yield improvement through drastic reduction of pad damage and cratering occurrences
  • Fits gold and copper wire applications
SIGMA II™ Major Benefits: 
  • Up to a 80% reduction in bond pad crack/damage rate
Other Features:
  • Packaging challenges: Wire bonding on sensitive bond pad
  • BPP range [μm]: [45 - 100]
  • WD range [mil]: [0.6 - 1.3]

General Inquiries

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