Tailor-made design for sensitive die structure
SIGMA II™ is a tailor-made design for Low-k and BOAC applications.
SIGMA II™ Key Attributes:
- Unique design which enables highly efficient ultrasonic response
- Enables yield improvement through drastic reduction of pad damage and cratering occurrences
- Fits gold and copper wire applications
SIGMA II™ Major Benefits:
- Up to a 80% reduction in bond pad crack/damage rate
Other Features:
- Packaging challenges: Wire bonding on sensitive bond pad
- BPP range [μm]: [45 - 100]
- WD range [mil]: [0.6 - 1.3]