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Consumables

Dicing Blades

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Dicing Blades - supported by our vast network of global resources and industry-leading expertise in all phases of back-end semiconductor packaging and assembly, the K&S dicing blade team is structured to help you, in every way, from improving yields to increasing your productivity, and ultimately attaining higher profitability.

Customizable hub blade solution for discrete wafer dicing
 
Hub blade dicing solution for copper metalized wafer
 
Enhanced hub blade solution for narrow street discrete wafer dicing
 
Customizable wafer dicing solution for advanced packaging
 
Hub blade solution for low-k wafer
 
Hub or hubless dicing solutions for LED package singulation
 
Hub blade solution for Silicon wafer dicing
 
Hub blade solution for quality and long-life cutting on package singulation material
 
Hubless blade solution for quality and long-life cutting on package singulation material
 

General Inquiries

We are here to help. Please complete the inquiry form and we will direct you to the right team.