Dicing Blades


HCL Hub Blades series provides a competitive solution to general silicon wafer dicing for quality, precision and CoO improvement by delivering superior product quality and value added features.

Key Features:
  • Enhanced Solution for Single & Step Cut Dicing Processes
  • New Hub Design to Enable High Spindle Frequency Application
  • Standardized Part Number Choice as Universal Solution
  • Shiny Bub with Enhanced Visual Control

General Inquiries

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