Quantis QFN

Latest capillary solution for copper wire bonding

Quantis™ QFN is the first in the Quantis family of copper wire bonding capillary products based on our latest and most advanced ceramics composite platform. This new capillary combines our extensive copper wire applications experience with the innovatively engineered geometrical designs produced to handle the toughest process challenges on a variety of QFN carriers.
Quantis™ QFN Key Attributes:
  • New RP1™ material - highest micro-structure quality and improved resistance to failure
  • Superior mechanical properties - improves consistency of performance

Quantis™ QFN Major Benefits:
  • Improved process stability and portability
    • Larger bonding parametric (process) window
    • Higher response consistency between capillaries
  • Competitive cost-of-ownership
    • Slower tip wear rate with enhanced design and material mechanical properties
    • Enhanced workability which translates into higher productivity
    • More bonds per capillary and per hour
Quantis™ QFN Application Range:
  • Copper wire diameter range: 0.7 - 2.5 [mil]
  • Copper wire type: Any
  • Package carrier families: Mid pin-count QFN’s & QFP’s (and their various sub-types)

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