ACS Lite

Copper capillary for low-pin count applications

ACS Lite™ is developed for low-pin count applications, such as discrete and power integrated circuit applications using large wire diameters. ACS Lite features new ACS advanced material. With this new product, customers will benefit from excellent bondability, robust consistent process thereby reducing their cost-of-ownership.
ACS Lite Key Attributes:
  • Improved workability (MTBA) and response consistency with large wire bonding performance
  • Higher resistance to wear and a more predictable lifespan

ACS Lite Major Benefits:
  • Competitive cost-of-ownership
  • Enhanced workability to help productivity
  • Improved material wear resistance for challenging processes
ACS Lite Application Range:
  • Bond pad pitch range: ≥120 [μm]
  • Copper wire diameter range: up to 2.5mil
  • Copper wire type: Any
  • Large pitch package carrier families, such as low-pin count lead frames, Power ICs, and LED

General Inquiries

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