Fine and ultra - fine pitch 1st bond reliability

CIC™ Key Attributes:
  • FP and UFP designs for 80 μm BPP and below
  • Tip, Whole & Chamfer specially designed to improve the 1st bond responses
  • Fits gold and copper wire application
CIC™ Major Benefits:
  • Tighter 1st bond diameter control with higher inter metallic coverage (IMC)
  • Reduction in pad peeling and cratering 
  • Improved 1st bond reliability
Other Features:
  • Packaging challenges: FP and UFP 1st bond reliability
  • BPP range [μm]: [25 - 80]
  • WD range [mil]: [0.45 - 1.3]

General Inquiries

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