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Capillaries

CIC

Publications

Bonding Tool Accessories Request Download
Bonding Tool Proper Handling Recommendations Request Download
Customized Product Identifiers Request Download
Fine Pitch Capillary Request Download
Large Wire Capillary Request Download
Product Selection Guide Request Download
Ultra Fine Pitch Capillary Request Download

Brochure

CIC - May 2003 Request Download

Fine and ultra - fine pitch 1st bond reliability

CIC™ Key Attributes:

FP and UFP designs for 80 μm BPP and below
Tip, Whole & Chamfer specially designed to improve the 1st bond responses
Fits gold and copper wire application

CIC™ Major Benefits:

Tighter 1st bond diameter control with higher inter metallic coverage (IMC)
Reduction in pad peeling and cratering
Improved 1st bond reliability

Other Features:

Packaging challenges: FP and UFP 1st bond reliability
BPP range [μm]: [25 - 80]
WD range [mil]: [0.45 - 1.3]

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