K&S Bonder-Capillary Proven Solution Benefits

For Various IC Packaging Challenges Associated with

• Interconnect for high density packages on wafer or substrate
• Electromagnetic interference (EMI) shielding for RF devices

The ProVertical Loop Process Enables

• Vertically bonded wires per requirements - Target Wire Height & Form Angle
• Minimized wire-to-wire pitch - No second bond knicking on substrate or wafer
• Reduced capillary-wire interference risk - Robust process linked to capillary geometry
• Improved overall process yield - Productivity (UPH) improvement of up to 5%

The Vertical Wire Bonding Capillary

• Design optimized - per package constrains (access restrictions, breakage risk) and physical properties (material, geometrical)
• Performance predicted - by design configurator specifically developed for vertical wire formation process