latest technology for gold wire bonding
iCap™ is a solution that goes beyond limits with a longer lifespan, improved productivity, and lower cost-of-ownership.
iCap™ Key Attributes:
- Special material composition - iZA
- Upgraded manufacturing process to enable better control of grains properties
- Unique design rules for improved dynamic behavior stability
iCap™ Major benefits:
- Improved productivity (MTBA) thanks to reduction in bonding failure
- iCap's lifespan is 4 times longer than the reference capillary at mass production conditions
Other Features:
- Packaging challenges: Capillary cost-of-ownership (Life & MTBA)
- BPP range [μm]: [40 - 120]
- WD range [mil]: [0.6 - 1.3]