Latest Capillary for low-pin count applications

VersaCap™ is K&S' latest capillary offering for the low-pin count packaging applications segment, such as LED and discrete semiconductors micro-chips.

VersaCap's design performance was successfully validated at leading LED chip-makers' production lines.
VersaCap™ Performance Benefits:
  • ​High ease-of-fit into running or newly optimized application process
  • Reliable stitch bond quality maintained over time
  • Reduced cost-of-ownership

VersaCap™ Product Characteristics:
  • Material platform: ITX, mature superior quality ceramics composite
  • Geometrical specifications: optimized for low-pin count applications
  • Unique feature: C2 tip finish type
  • Able to fit into K&S or other capillary parametric window

VersaCap™ Application Range:
  • Device types: predominantly LED and discrete (all types)
  • Bond pad pitch range [μm]: 120 - 300
  • Wire diameter range [mil]: 0.8 - 2.5
  • Ball bonder models: all
Mass Production Performance 3528 RGB LED Bonding Process Conditions:
  • Device – SMD LED 3528, min BPO 45 [µm]
  • Bonder – K&S ConnX-LED
  • Wire – 0.8 [mil], bare Cu
  • Test sample size – 23 capillaries on 15 bonders

  • VersaCap enables to extend the production capillary lifespan by 600 KB
  • The stitch bond quality of VersaCap remains well above the 6 grams force  throughout the whole production run
  • VersaCap demonstrates statistically superior usability at mass production tests
  • An average of 960 K bonds for VersaCap compared to 480 K bonds
  • VersaCap stitch bond imprint quality is maintained throughout the entire life test

Mass Production Performance 2121 RGB LED Bonding Process Conditions:
  • Device – RGB LED 2121, min BPO 45 [µm]
  • Bonder – K&S ConnX-LED
  • Wire – 0.7 [mil], bare Cu
  • Test sample size – 4 capillaries on 4 bonders

  • VersaCap outperforms the competitor’s capillary at lifespan test, reaching an average of 1,250 K bonds

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