Latest Capillary for low-pin count applications
VersaCap™ is K&S' latest capillary offering for the low-pin count packaging applications segment, such as LED and discrete semiconductors micro-chips.
VersaCap's design performance was successfully validated at leading LED chip-makers' production lines.
VersaCap™ Performance Benefits:
- High ease-of-fit into running or newly optimized application process
- Reliable stitch bond quality maintained over time
- Reduced cost-of-ownership
VersaCap™ Product Characteristics:
- Material platform: ITX, mature superior quality ceramics composite
- Geometrical specifications: optimized for low-pin count applications
- Unique feature: C2 tip finish type
- Able to fit into K&S or other capillary parametric window
VersaCap™ Application Range:
- Device types: predominantly LED and discrete (all types)
- Bond pad pitch range [μm]: 120 - 300
- Wire diameter range [mil]: 0.8 - 2.5
- Ball bonder models: all
Mass Production Performance 3528 RGB LED Bonding Process Conditions:
- Device – SMD LED 3528, min BPO 45 [µm]
- Bonder – K&S ConnX-LED
- Wire – 0.8 [mil], bare Cu
- Test sample size – 23 capillaries on 15 bonders
Results:
- VersaCap enables to extend the production capillary lifespan by 600 KB
- The stitch bond quality of VersaCap remains well above the 6 grams force throughout the whole production run
- VersaCap demonstrates statistically superior usability at mass production tests
- An average of 960 K bonds for VersaCap compared to 480 K bonds
- VersaCap stitch bond imprint quality is maintained throughout the entire life test
Mass Production Performance 2121 RGB LED Bonding Process Conditions:
- Device – RGB LED 2121, min BPO 45 [µm]
- Bonder – K&S ConnX-LED
- Wire – 0.7 [mil], bare Cu
- Test sample size – 4 capillaries on 4 bonders
Results:
- VersaCap outperforms the competitor’s capillary at lifespan test, reaching an average of 1,250 K bonds