capillary solution for advanced memory & logic devices
TeraCap™ is the latest capillary series for advanced memory and logic devices packaging using either gold or silve wire.
TeraCap™ Major Benefits:
- Excellent bonding and looping consistency (yield)
- Superior workability (MTBA - more bonds per hour)
- Extended durability (more bonds per capillary)
TeraCap™ Key Attributes:
- New iZX high quality composite ceramics
- Tighter control over critical dimensions -0/+1 [μm]
- Designed specifically for various memory devices structures (stacked, deep access, overhang), and bonding modes
TeraCap™ Application Range:
- Bond pad pitch [μm]: 40 - 120
- Wire diameter [μm]: 15 - 33
- Wire type: any gold and silver alloy wire
- Device types: any memory and logic devices