Copper capillary for High-pin count applications
ACS Pro™ is a new generation of copper capillary based on strong material development and application knowledge, which offers great operation benefits for advanced copper wire bonding applications.
ACS Pro Key Attributes:
- Ultra fine pitch design fit - a new material for longer lifespan
- New ITX™ material - superior properties of advanced processing ceramics, enhances the capillary workability and usable life
- High precision key features - controlled to satisfy the most critical responses of fine copper wire bonding requirements
ACS Pro Major Benefits:
- Excellent bond-ability control with fine wire diameters
- Advanced design rules to maintain 1st and 2nd bond quality over time
- Improved process portability and response consistency
- Design dynamics to ease the limited copper process window
- Consistent performance for smooth production fan-out
- Competitive cost-of-ownership
- Enhanced workability to help productivity
- Improved material wear resistance for challenging processes
ACS Pro Best Fit Range:
- Bond pad pitch range: 40 – 69 [μm]
- Copper wire diameter range: 0.6 – 1.0 [mil]
- Copper wire type: Any
- Advanced package carrier families, such as BGAs