Wedge Bond Consumables

Ribbon Wedge

PowerRibbon® is an ultrasonic bonding process for ribbon optimized for the challenging requirements of the power electronics industry. It offers electrical performance advantages such as very high current capacity, reduced current crowding, and low contact resistance. Ribbon width and thickness can be specified independently, thus increasing the choices for interconnect dimensions, and maximizing the use of package space while reducing the number of interconnects needed.

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