Ball Bonder


Advanced wire bonder for discrete and low pin count devices used in communication and consumer application giving users the lowest cost of ownership with improved UPH and uptime.
Key Features: 
  • Bondable Area of 56 mm x 87 mm
  • New Proprietary Quick Suite Provides Robust Process Performance at Maximum UPH 
  • Complete Illumination System with Automatic Adjustment for PRS Robustness
  • Enhance Auto SHTL and NSOL Recovery for Improved MTBA Performance
  • Minimum Crosshair Offset of 4mm to Improve Lookahead Function 
  • Improved BITS Detection of 0.5pF

General Inquiries

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