Advanced wire bonder for discrete and low pin count devices used in communication and consumer application giving users the lowest cost of ownership with improved UPH and uptime.
Key Features:
- Bondable Area of 56 mm x 87 mm
- New Proprietary Quick Suite Provides Robust Process Performance at Maximum UPH
- Complete Illumination System with Automatic Adjustment for PRS Robustness
- Enhance Auto SHTL and NSOL Recovery for Improved MTBA Performance
- Minimum Crosshair Offset of 4mm to Improve Lookahead Function
- Improved BITS Detection of 0.5pF