Ball Bonder


Leading edge cost performance wire bonder with the lowest cost of ownership arising from improved UPH and machine uptime.
Key Features: 
  • Leadframe Width of 92 mm, 95 mm and 100 mm
  • New Proprietary Quick Suite Provides Robust Process Performance at Maximum UPH 
  • New Illumination Design to Provide Enhanced Lighting for PRS
  • Enhance Auto SHTL and NSOL Recovery for Improved MTBA Performance
  • Minimum Crosshair Offset of 4mm to Improve Lookahead Function 
  • Piezo Wire Clamp Design with Auto Calibration

General Inquiries

We are here to help. Please complete the inquiry form and we will direct you to the right team.