ACELON™ offers exceptional process stability, ensuring reliable performance in critical production environments. Its expanded working area provides flexibility to handle larger substrates and complex assembly configurations


Its advanced jetting technology achieves <20 µm wet dispensing accuracy, while twin or dual-valve and EFEM-ready wafer stage configurations provide exceptional flexibility.



Integrated AI-powered software, including post-AOI, SUF (Smart UnderFill), and APT (Automatic Parameters Tuning) capabilities, enhances process control, drives higher yields, and further improves productivity and COO (cost of ownership).

High-Precision Performance

Smart dispensing

  • High performance dispenser for underfill, solder paste, epoxy, dam & fill, SMT, LED encapsulation.
  • The Smart UnderFill feature automatically optimizes the dispensing sequence during the underfill process to maximize machine utilization.
  • Additionally, APT leverages built-in AOI capabilities to measure dispensing results and fine-tune parameters.
Proven Reliability

Trusted platform

Built on the proven K&S Wedge Bonder Platform with over 3,000 units in mass production.

Scalable Capacity

Expanded coverage

Provides greater flexibility for larger substrates and complex assemblies with an expanded working area (XYZ) of 360 × 600 × 100 mm.

Expanded Bond Area
Micron Accuracy

Precision control

Offers precise glue dispensing with an accuracy of < 20 µm.

Dual-Valve Power

Enhanced throughput

Optional “twin valve, dual valve” configuration designed to enhance UPH performance.

Intelligent Automation

Smart software

AI-powered automation features ensure precise, consistent dispensing with minimal defects. Maintain optimal flow volume, maximize yield, UPH, and more.

YOU MAY ALSO LIKE

Other products

Desktop Robot series
Desktop Robot series
Desktop Robot series is designed to be robust, fast, and accurate
SL series
SL series
Designed for semiconductor microfluid packaging applications
XLS series
XLS series
Developed for high precision microfluid packaging
YOU MAY ALSO LIKE

Other content

SEMICON Taiwan
SEMICON Taiwan
SEMICON TAIWAN is not just a platform that connects Taiwan and global microelectronics ecosystems but also a bridge that facilitates smooth collaboration between the industry, the government, academia, and research institutions. Witnessing enormous business collaboration, SEMICON TAIWAN still stays true to its missions― Leading Technology Trends, Driving Technology Innovation, and Facilitating Collaboration and continues providing various channels and activities that meet the companies' marketing and promotion needs.
SEMICON India
SEMICON India
SEMICON India 2025 is envisioned as a pivotal milestone in India’s ascent as a trusted global partner in the semiconductor supply chain. Organized jointly by ISM and SEMI under the visionary leadership of Hon’ble Prime Minister Shri Narendra Modi, the event convenes a wide spectrum of participants—industry leaders, innovators, academia, government, and start-ups—to catalyze collaboration and advancement across the entire microelectronics ecosystem.
SEMIEXPO Vietnam
SEMIEXPO Vietnam
As the global semiconductor landscape continues to evolve, Vietnam is positioning itself for a promising future in the semiconductor industry. SEMIEXPO Vietnam will be a pivotal event, exploring opportunities for businesses across the semiconductor value chain, from assembly and testing to fabless/design. This premier event will highlight how local players can elevate Vietnam’s position in the global semiconductor supply chain.
Cookie Settings

We use cookies to provide you the best experience on our website. By accepting this message, you agree to our use of cookies.