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ACELON™ offers exceptional process stability, ensuring reliable performance in critical production environments. Its expanded working area provides flexibility to handle larger substrates and complex assembly configurations


Its advanced jetting technology achieves <20 µm wet dispensing accuracy, while twin or dual-valve and EFEM-ready wafer stage configurations provide exceptional flexibility.



Integrated AI-powered software, including post-AOI, Smart UnderFill, and Automatic Parameters Tuning capabilities, enhances process control, drives higher yields, and further improves productivity and cost of ownership.

High-Precision Performance

Smart dispensing

  • High performance dispenser for underfill, solder paste, epoxy, dam & fill, SMT, LED encapsulation.
  • The Smart UnderFill feature automatically optimizes the dispensing sequence during the underfill process to maximize machine utilization.
  • Additionally, APT leverages built-in AOI capabilities to measure dispensing results and fine-tune parameters.
Proven Reliability

Trusted platform

Built on the proven K&S Wedge Bonder Platform with over 3,000 units in mass production.

Scalable Capacity

Expanded coverage

Provides greater flexibility for larger substrates and complex assemblies with an expanded working area (XYZ) of 360 × 600 × 100 mm.

Expanded Bond Area
Micron Accuracy

Precision control

Offers precise glue dispensing with an accuracy of < 20 µm.

Dual-Valve Power

Enhanced throughput

Optional “twin valve, dual valve” configuration designed to enhance UPH performance.

Intelligent Automation

Smart software

AI-powered automation features ensure precise, consistent dispensing with minimal defects. They also help maintain optimal flow volume, maximize yield and UPH, and improve overall performance.
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