logo
search menu


ACELON™ offers exceptional process stability, ensuring reliable performance in critical production environments. Its expanded working area provides flexibility to handle larger substrates and complex assembly configurations


Its advanced jetting technology achieves <20 µm wet dispensing accuracy, while twin or dual-valve and EFEM-ready wafer stage configurations provide exceptional flexibility.



Integrated AI-powered software, including post-AOI, SUF (Smart UnderFill), and APT (Automatic Parameters Tuning) capabilities, enhances process control, drives higher yields, and further improves productivity and COO (cost of ownership).

High-Precision Performance

Smart dispensing

  • High performance dispenser for underfill, solder paste, epoxy, dam & fill, SMT, LED encapsulation.
  • The Smart UnderFill feature automatically optimizes the dispensing sequence during the underfill process to maximize machine utilization.
  • Additionally, APT leverages built-in AOI capabilities to measure dispensing results and fine-tune parameters.
Proven Reliability

Trusted platform

Built on the proven K&S Wedge Bonder Platform with over 3,000 units in mass production.

Scalable Capacity

Expanded coverage

Provides greater flexibility for larger substrates and complex assemblies with an expanded working area (XYZ) of 360 × 600 × 100 mm.

Expanded Bond Area
Micron Accuracy

Precision control

Offers precise glue dispensing with an accuracy of < 20 µm.

Dual-Valve Power

Enhanced throughput

Optional “twin valve, dual valve” configuration designed to enhance UPH performance.

Intelligent Automation

Smart software

AI-powered automation features ensure precise, consistent dispensing with minimal defects. Maintain optimal flow volume, maximize yield, UPH, and more.

YOU MAY ALSO LIKE

Other products

Desktop Robot series
Desktop Robot series
Desktop Robot series is designed to be robust, fast, and accurate
SL series
SL series
Designed for semiconductor microfluid packaging applications
XLS series
XLS series
Developed for high precision microfluid packaging
YOU MAY ALSO LIKE

Other content

SEMICON China
SEMICON China
Discover the next generation of advanced packaging and electronics assembly solutions.
SEMICON SEA
SEMICON SEA
SEMICON Southeast Asia has become an important exposition for the electronics industry in Southeast Asia. The show connects the decision makers from the industry, demonstrates the most advanced products, and brings in the most up-to-date market and technology trends.
ECTC
ECTC
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society.
Cookie Settings

We use cookies to provide you the best experience on our website. By accepting this message, you agree to our use of cookies.