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Dual dispenser system supporting high throughput.
Fully programmable die ejector needle movement synchronized with pick & place Z movement.
Thin die capability at high speed.
Device height sensor for accurate Z-height control.
Pre-bond (solder) and post-bond die inspection, image capture (and saving) on demand.
Dual dispenser system supporting complex clip layouts.
Highly accurate bond head theta axis.
Real-time pick & bond force monitoring.
Large field of view vision.
Up-looking vision system for missing clip detection.
K&S designs and provides the application specific tooling.
Pre-bond (solder) and post-bond clip array inspection.
Application specific voiding < 5%.
Low oxygen level in the complete oven, with industry leading low gas consumption.
Active exhaust system with integrated filters.
Real time process parameter (temperature, pressure, gas flow, etc.) monitoring and data collection.
Multi-step vacuum profiles.
Dual vacuum chamber option.
Stand-alone operation upon request.
