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The Avaline™ is built with cutting-edge technology in die and clip attach, including a vacuum solder reflow system. Providing industry-leading quality and throughput for reduced cost of ownership.


Avaline™ ensures superior reliability in power discrete manufacturing by achieving ultra-low voiding.



Its dual dispenser system and precision motion control enable high-throughput clip and die placement, supporting complex arrays and die sizes.

Avaline™ – D

Proven die handling technology

  • Dual dispenser system supporting high throughput.

  • Fully programmable die ejector needle movement synchronized with pick & place Z movement.

  • Thin die capability at high speed.

  • Device height sensor for accurate Z-height control.

  • Pre-bond (solder) and post-bond die inspection, image capture (and saving) on demand.

Avaline™ – C

Large clip array transfer capability

  • Dual dispenser system supporting complex clip layouts.

  • Highly accurate bond head theta axis.

  • Real-time pick & bond force monitoring.

  • Large field of view vision.

  • Up-looking vision system for missing clip detection.

  • K&S designs and provides the application specific tooling.

  • Pre-bond (solder) and post-bond clip array inspection.

Avaline™ – V

Vacuum reflow capability

  • Application specific voiding < 5%.

  • Low oxygen level in the complete oven, with industry leading low gas consumption.

  • Active exhaust system with integrated filters.

  • Real time process parameter (temperature, pressure, gas flow, etc.) monitoring and data collection.

  • Multi-step vacuum profiles.

  • Dual vacuum chamber option.

  • Stand-alone operation upon request.

HOW IT WORKS

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