Avaline™ 采用尖端的芯片贴装技术及铜片贴装技术,集成真空回流技术系统, 为行业带来领先的产能和生产品质,并有效降低客户的使用成本


Avaline™ 通过实现极低的void,确保了功率分立器件制造中卓越的可靠性。



其双点胶系统与精密运动控制技术,能够实现高产能的铜片与芯片贴装,并支持不同尺寸铜片矩阵排列及数量。

Avaline™ – D

久经考验的芯片处理技术

  • 双点胶头设计提高产能

  • 顶针,吸嘴,及焊头动作可以完全独立编程控制,顶针和pick动作可同步移动

  • 高速薄芯片抓取

  • 高精度的芯片贴装高度控制

  • Pre-bond (solder)及Post-bond的检测及影像截取(存储)

Avaline™ – C

大尺寸夹片阵列传输能力

  • 支持双点胶头与复杂的画胶需求

  • 高精度位置及角度的控制

  • 芯片抓取及贴片力度的实时监控

  • 大范围视觉系统

  • Missing Clip检测能力

  • 提供治具客制化服务

  • Pre-bond (solder)及Post-bond的铜片矩阵检测能力

Avaline™ – V

真空回流能力

  • Application spec voiding < 5%.

  • 在业界最低氮气消耗量下达成回流炉低氧量控制

  • 配有过滤网的自主气体排放系统

  • 制程参数(温度,压力,气体流量等)实时监控

  • 多步骤真空曲线控制

  • 可选1~2个真空加热腔

  • 真空炉可以独立出售

工作原理

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