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3.0 µm accuracy @ 3 sigma.
Complete illumination system with automatic adjustment for Pattern Recognition System (PRS) robustness.
Single 2X magnification optics.
2X/4X dual magnification optics (optional).
Bondable area of 56 mm x 80 mm (fits more/larger devices per run).
New high speed X-Y-Z motion control and vision systems.
Quick-LED Suite provides robust process performance at maximum UPH (units per hour).
Interactive programmable look ahead vision for maximum throughput.
Reel-To-Reel material handling (optional, continuous production).
Auto SHTL and NSOL Recovery for improved Mean Time Between Assists (MTBA).
Auto-BITS self-teach and optimization.
Bonding Ag-Alloy, PdCu, and Cu wire (optional, flexible material handling).