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Optimized for communication and consumer electronics applications, POWERCOMM™ delivers unmatched bonding performance and production efficiency.


The new generation Quick Suite 2 Process is designed to maximize UPH, delivering higher efficiency and throughput for every run.



Combined with POWERCOMM’s portability, the system ensures the fastest production fan-out across the machine fleet.

DRIVE PERFORMANCE

Maximized productivity

  • Quick Suite 2 processes deliver robust process performance at the highest UPH.

  • New material handling and vision systems reduce indexing and alignment times.

UPTIME STABILITY

Highest uptime and MTBA

Full suite of automatic error recovery features.
DEFECT DETECTION

Inspection & quality control

  • On-bonder inspection capabilities ensure process quality.

  • Portability solutions enable consistent performance across the fleet.

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