Find what matters.
Search requires at least 3 characters
No result found
Quick links
Suggested searches
Search requires at least 3 characters
No result found
Quick links
Suggested searches
CIC™ is purpose-built for fine-pitch applications up to 80 µm BPP, featuring FP and UFP designs with optimized tip, whole, and chamfer geometry. These enhancements deliver sharper first bond responses and ensure compatibility across both gold and copper wire processes.
CIC™ achieves tighter first bond diameter control with improved intermetallic coverage, minimizing pad peeling and cratering. Its refined engineering enhances first bond reliability and ensures consistent performance in demanding production environments.
Designed to address FP and UFP first bond reliability challenges, CIC™ supports bond pad pitches from 25–80 µm and wire diameters between 0.45–1.3 mil. This provides flexibility for a wide range of packaging needs.
