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Quantis™ PLUS delivers strong performance on BGA, QFP, and hard-plated substrates. Including palladium pre-plated QFN and QFP types, commonly used in automotive packaging. Its RP2 material, optimized tip morphologies, and carefully refined design improve bonding strength, gripping, productivity, and cost of ownership.


Enhances bonding productivity with improved MTBA and offers competitive cost-of-ownership through the new RP2 material’s slower tip wear rate.



Its design is precisely engineered to fit both PPF and micro-PPF chip carriers, ensuring stable, high-performance bonding across applications.

WEAR-RESISTANT PERFORMANCE

Tip-durability optimization

  • Quantis™ PLUS uses RP2 material to deliver superior resistance to tip wear across all chip carrier types, including PPF and micro-PPF.
  • It offers two capillary tip morphologies: the default M7, which easily fits into an existing process window, and the optional C45, designed to support new copper wire bonding process qualifications.
PRODUCTIVITY GAINS

Bonding stability

  • Quantis™ PLUS enhances bonding process productivity by maintaining strong, consistent second-bond performance over longer periods.
  • Its M7 and C45 tip morphologies improve capillary-to-wire gripping, reducing bonding failures and supporting longer MTBA for more efficient, reliable operation.
COST EFFICIENCY

Wear longevity

Quantis™ PLUS delivers a competitive cost of ownership by enabling more bonds per capillary and per working hour, supported by the RP2 material’s slower tip-wear rate for longer-lasting performance.

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