K&S's bonder-capillary solutions enhance reliability and productivity in advanced IC packaging. Designed to support high-density interconnects and minimize interference, they enable precise vertical wire bonding with improved yield and consistent performance.


Optimized for package constraints and material properties, this design minimizes access limitations and breakage risks.



Using a dedicated configurator to predict performance for vertical wire formation, it ensures precise geometries that reduce capillary-wire interference and enhance overall process reliability.

High Density

Interference control

K&S bonder-capillary solutions address advanced IC packaging needs, enabling reliable interconnects for high-density wafer and substrate designs while minimizing electromagnetic interference in RF device applications.

Vertical Precision

Yield improvement

The ProVertical Loop process ensures precise vertical wire bonding with optimized wire height and pitch control. It reduces interference and second-bond defects, improving process yield and achieving up to 5% higher productivity.

Design Optimization

Process predictability

Each capillary is tailored for specific package constraints and physical parameters, balancing accessibility and material strength. Its performance is accurately modeled through design configuration to ensure stable, repeatable results in vertical wire formation.

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