Vertical Wire Bonding

Enhances first bond reliability through precise design and control

Engineered for a longer lifespan and workability

Designed for advanced memory and logic device packaging

The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society.

Innovation and advancement thrive on passion, expertise, and dialog. The PCIM Expo brings all this together in one place, offering the ideal framework for turning visions into reality. Showcasing pioneering solutions along the entire power electronics value chain, the PCIM Expo provides a springboard for innovation.

SEMICON TAIWAN is not just a platform that connects Taiwan and global microelectronics ecosystems but also a bridge that facilitates smooth collaboration between the industry, the government, academia, and research institutions. Witnessing enormous business collaboration, SEMICON TAIWAN still stays true to its missions― Leading Technology Trends, Driving Technology Innovation, and Facilitating Collaboration and continues providing various channels and activities that meet the companies' marketing and promotion needs.