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APTURA™ is engineered to meet the evolving demands of heterogeneous integration across wafers, substrates, and even 310 mm panels, positioning it as the most versatile and future-ready Thermo-Compression Bonding (TCB) platform. As the industry shifts toward panel-level packaging for cost efficiency and scalability, APTURA™ enables customers to transition seamlessly without compromising performance.

Why choose plasma or formic acid? Every heterogeneous integration (HI) package is unique. Choose the one platform that supports them all.


From lab to fab: Proven fluxess thermo-compression bonding performance for high-volume manufacturing.



No flux. No compromise. Discover the future of thermo-compression bonding.



Precision bonding for the next generation of heterogeneous integration.

Complete Versatility

Unmatched process flexibility

Heterogeneous integration requires multiple oxide removal strategies—dip flux, plasma, plasma + formic acid (FA), or FA alone. APTURA™ offers all these options in a single platform, eliminating the need to choose.

Seamless Consistency

Recipe portability & tool-to-tool matching

Seamless recipe transfer ensures consistent performance and accelerates ramp-up for high-volume manufacturing.

Connected Intelligence

Enhanced remote process control

Real-time monitoring and optimization from anywhere, reducing downtime and improving yield.

Growing Capability

Scalable architecture

Supports wafers, substrates, and panels (starting at 310mm x 310mm, scaling to larger formats) for next-generation packaging.

HOW IT WORKS

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