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Building on the proven success of the Power Series, the ATPremier LITE™ brings advanced stud bumping to wafer level packaging. Engineered for productivity, it inherits the superior performance of the ATPremier PLUS™ while offering a more cost-effective solution.


ATPremier LITE™ combines precision, efficiency, and scalability in a compact form.



Supporting up to 200 mm wafers with a dual-ramp chuck option for enhanced throughput, while maintaining ±3.5 µm accuracy. It has the smallest footprint in its class and delivers exceptional value in cost and performance.

Process Flexibility

Bonding capability

ATPremier LITE™ supports bonding up to 200 mm wafers, ceramics, or substrates. Including a 4” dual-ramp chuck option for enhanced throughput.

PRECISE PLACEMENT

Bond placement accuracy

Highly capable to maintain ± 3.5 µm @ 3 sigma accuracy during placement (200 mm work piece).

Thermal Efficiency

Gold Bumping

Advanced low temperature gold bumping.

Automation Ready

Factory automation integration

Capability to integrate Auto Wafer Handler or EFEM for factory automation.

Expanded Bond Area
Easy Maintenance

Improved serviceability

Easy access to lower console.

Alloy Flexibility

Upgradeable capabilities

Optional copper or silver alloy capability and kits.

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