基于“力”系列平台的成功经验,ATPremier LITE™ 将先进的植球技术引入晶圆级封装领域。该系统旨在提升生产力,在继承 ATPremier PLUS™ 卓越性能的同时,提供更具成本效益的解决方案。


ATPremier LITE™ 在紧凑的设计中融合了精密性、高效率与可扩展性。



可处理高达200 mm的晶圆,可选双工作台以进一步提升产能,同时保持±3.5 µm的精度。它是同类产品中占地面积最小的设备,兼顾卓越性能与成本控制。

工艺灵活性

植球能力

ATPremier LITE™ 支持高达200mm的晶圆、陶瓷基板或各类基板。提供4英寸工作台选项,显著提升产能

精准贴装

高精度植球定位

在 200 mm 晶圆处理过程中,具备在± 3.5 µm @ 3 sigma 精度下持续作业的高超能力

热效率优势

先进金线植球

行业领先的低温金线植球技术

自动化就绪

工厂自动化集成

支持集成自动晶圆搬运系统 (Auto Wafer Handler) 或EFEM,实现工厂全自动化运作

Expanded Bond Area
轻松维护

随时保持最佳状态

下层控制台采用易开启设计

灵活适配合金线工艺

可升级的工艺能力

可选配铜线或银合金线套件

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