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Tooling provides a stable, clamping solution required for high-quality wire bonding. Every component is precision-engineered to hold devices securely, minimize movement, and maintain consistent alignment before the start of the bonding process.


With fully customizable configurations, it ensures reliable performance, excellent bond quality, and meets each customer’s unique device requirements.



Unique configurations to accommodate single-row to multi-row leadframe designs, as well as other complex designs such as power modules, IPMs, SPMs, and more.



Options include universal and custom fingers, metal and vacuum anvils, and specialized workholders.

STABILITY MEETS ACCURACY

Secured before bonding

Tooling is designed to securely hold devices in place before starting the high-energy wire bonding process. Its precision-engineered rigidity prevents micro-shifts, ensuring stability throughout the bonding process.

Tailored to your application

Highly adaptable

From TO single-row to multi-row leadframes, our tooling covers complex designs such as power modules, IPMs, SPMs, and more. Each solution is fully customized to meet individual customer application requirements.

  • Universal type: Widely applied in single-row leadframe applications, available in straight, 45°, and 90° bend options.
  • Custom type: Frequently utilized in multi-row leadframe application, available in single-stack, multi-stack, individual, or comb-type configurations, customized based on application requirements and complexity.
SOLUTIONS FOR R&D AND CONTAMINATION REMOVAL

Special tooling solutions

  • Manual workholder solution: Ideal for R&D device applications, this solution is available in both vacuum and non-vacuum types. It is tailored to meet specific application requirements and complexity.
  • Contamination removal system (CRS) kit: Designed to eliminate unwanted particles and prevent static charge buildup on PCB substrates or leadframes.
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