TeraCap™ 为高端存储器与逻辑器件封装提供了卓越的焊接一致性、耐用性与生产效率。它采用高质量复合陶瓷材料打造,确保了稳定的性能表现、精密的工艺控制以及更长的使用寿命,帮助客户实现更高的良品率。


提供出色的焊接与弧度一致性,显著提升生产良率;凭借优异的操作性改善 MTBA 表现,并具备更强的耐用性——实现单支焊针更高数量的键合,助力达成卓越的综合生产效率。

焊接一致性

高效良率

TeraCap™ 具备稳定且可重复的焊接与弧度控制性能,并提供优异的操作性与工具寿命。它能确保更高的产出能力与一致的良品率,是高端器件大规模量产的理想选择。

精密控制

尺寸稳定性

  • TeraCap™ 采用全新的 iZX 高质量复合陶瓷材料打造,具备更严苛的尺寸公差控制能力和更强的结构可靠性。
  • 其设计方案能够完美适配复杂的存储器架构,确保焊接结果精准且可靠。
广泛的焊接适配性

多样化应用场景

  • 支持 40-120 µm 的焊接间距和 15-33 µm 的焊线直径。
  • 适配各类金线、合金线,广泛应用于各种存储器及逻辑芯片应用。
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为更长寿命与卓越表现而打造
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为 SIP及存储器封装而设的解决方案
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