EMPOWER YOUR CHIP BONDING

Thermo-Compression Bonding (TCB) for APU, ARM CPU, SiPh, and VCSEL packaging has been K&S's forte, achieved by enabling process features to our technology partners and delivering respectable productivity and efficiency in the market.

As demands for high-performance computing for servers, artificial intelligence, and cloud applications continue to rise, the industry faces several bonding challenges. With the traditional TCB approach, ultra-large dies, ultra-fine pitch I/O interconnects, or flux-sensitive devices such as chiplets or silicon photonic applications may face flux-related issues.

K&S’s next generation of TCB solution, the latest APTURA™ series, offers the first-of-its-kind “fluxless bonding”, enabling direct Cu-to-Cu and bumpless bonding. This innovative approach eliminates the need for traditional flux materials, reduces contamination risks, and enhances the reliability and performance of the microelectronic devices.

The APAMA Series offers fully Automated Chip-to-Substrate (C2S) and Chip-to-Wafer (C2W) solutions for Thermo-Compression Bonding (TCB).