Ball Bonder


K&S Gen-S Series Automatic wire bonder

RAPID™ introduces advanced process capabilities, real-time monitoring and diagnostics to ensure the best quality and efficient assembly serving high-performance and high-reliability semiconductor applications.
Key Features:
  • Real-time Process & Performance Monitoring
  • Real-time Equipment Health Monitoring
  • Advanced Data Analytics & Traceability
  • Predictive Maintenance Monitoring & Analysis
  • Detection & Enhanced Post bond Inspection

Bondable Area Configurations:
  • RAPID LA (Large Area)
  • RAPID ELA (Extended Large Area)

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