First K&S Gen-S Series Automatic wire bonder
RAPID™ Pro introduces advanced process capabilities, real-time monitoring and diagnostics to ensure the best quality and efficient assembly serving high-performance and high-reliability semiconductor applications.
Key Features:
- Real-time Process & Performance Monitoring
- Real-time Equipment Health Monitoring
- Advanced Data Analytics & Traceability
- Predictive Maintenance Monitoring & Analysis
- Detection & Enhanced Post bond Inspection
- Most Advanced Response Based Processes
- ProCu-6, ProAu-2, ProAg
- PSP-Cu, PSP-Ag
- ProCu Loop
Bondable Area Configurations:
- RAPID Pro LA (Large Area)
- RAPID Pro ELA (Extended Large Area)