Opto PLUS

提升质量、精度与使用成本的封装切割优化方案

无法兰设计实现后道封装切割工艺的“零转换”

提升切割质量，同时缩短预切割时间并减少整体使用成本

From AI and advanced packaging to smart manufacturing, sustainability, mobility, MedTech, and workforce development, SEMICON West is where the industry comes together to solve challenges, accelerate innovation, and build strategic partnerships.

The 28th IEEE Electronics Packaging Technology Conference (EPTC 2026), the IEEE EPS flagship event in the Asia-Pacific region, invites original abstracts showcasing cutting-edge research and innovations in electronics packaging.

As the global semiconductor landscape continues to evolve, Vietnam is positioning itself for a promising future in the semiconductor industry. SEMIEXPO Vietnam will be a pivotal event, exploring opportunities for businesses across the semiconductor value chain, from assembly and testing to fabless/design. This premier event will highlight how local players can elevate Vietnam’s position in the global semiconductor supply chain.