ENHANCED CAPABILITY HYBRID WEDGE BONDER
The Asterion™ SV
(Stretched Version) Wedge Bonder is built on a re-engineered architecture that includes an expanded bond area, new robust pattern recognition capabilities, and extremely tight process controls. Together these deliver heightened productivity, bonding quality, and reliability. The enlarged bondable area enhances flexibility and reduces line integration costs. Asterion™ is driven by a precise new direct-drive motion system that requires minimum maintenance and delivers high repeatability. The graphical editor, multi-segment bonding, global parameter change, and a library of new software features, make programming and optimizing the bonding process of complex devices relatively easier. In addition, the wire feed system offers a large capacity external wire spool dereeler.
- Market leader in wedge bonding, global coverage and support
- Large bondable area (300mm x 985mm)
- Industrial standard communication protocol
- Direct drive motion system with less frequent maintenance