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The Asterion® SV (Stretched Version) wedge bonder utilizes cutting-edge technology, including precise position control and accurate pattern recognition, along with a stretched 300 mm x 985 mm bondable area and compatibility with high-capacity K125 spools, to maximize productivity, bond quality, and reliability.


Asterion® SV has a 300 mm × 985 mm bondable area. It supports single and multi-lane automation, while compatibility with K125 spools extends MTBA and reduces operator intervention.



Time-proven K&S large wire, configurable, and high-power bond heads enable robust wire, leveraging industry-leading bond process expertise.



The new Tab Bond Head enables ultrasonic spot welding of aluminum and copper tabs without the need for heat, particulates, or complex fixturing.



Integrated battery cell mapping enhances PR robustness and ensures precise wire placement without upstream vision systems, reducing system complexity and cost.

EFFICIENCY AT SCALE

Designed for high-volume production

The Asterion® SV is used in the world’s largest cylindrical battery cell interconnect factory, with proven reliability in high-volume production.


  • Compatible with high-capacity K125 spools to maximize MTBA.

  • Supports multiple form factor products on single or multi-lane automation with a large bondable area of 300 mm x 985 mm.

  • Two Asterion® SVs can be conjoined to optimize floor space and throughput by concurrently bonding long battery modules.

Smart Supervision

Easy to use

  • Customizable user interface displays specific functions and information to suit your needs.

  • Bonded device review displays captured images for review during auto run.

  • Standardized user interface across platforms with Poka Yoke and automated calibration features.

Continuous Validation

Quality assurance

  • Graphical bondhead setup with pattern recognition (GBS PR) provides automated visual feedback during consumables setup.

  • Non-destructive pulltest provides in-situ quality check during production.

  • Bond Process Monitoring (BPM+) monitors each bond to identify those that fail to meet quality standards.

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