Wedge Bonder


High Performance wedge bonder

The PowerFusion™ wedge bonders are driven by a new powerful direct-drive motion system and expanded pattern recognition capabilities which deliver industry leading productivity and reliability. Systems are available in single, dual, or multi-head configurations.

Three models of the PowerFusion bonder are available:
  • PowerFusion TL is the perfect choice for bonding TO power devices

    The TL Model is the perfect choice for bonding single-row to four-row matrix TO power devices.  PowerFusionPS's industry leading productivity reduces your manufacturing costs and delivers optimum pattern recognition and superior bonding performance.  It is upgradeable to the HL Model should advanced packaging requirements be in your future.
  • PowerFusion HL provides the accuracy and capability required to process the most advanced power packages

    The HL Model is specially designed to enable large wire, small wire and PowerRibbon bonding in advanced packaging designs.  Whether you are bonding high density power devices like SO-8 & PDFN or stretching the wire limit on a matrix D-Pak, the superior indexing accuracy and clamping capabilities of the HL Model deliver consistent quality.
  • PowerFusion HLx can handle extra-wide matrix and IPM leadframes up to 105 mm wide

    The HLx Model has all the capabilities of the HL Model with the added benefit of handling leadframes up to 105 mm wide. Whether you have a current requirement for wide leadframe processing or just want to invest in a flexible platform for future leadframe development, the HLx Model is the best choice for many applications.
Key Advantages:
  • Increased UPH and higher MTBA
  • Greater bond placement repeatability
  • Ease of use
  • Reduced preventive maintenance requirements on major components

  • New Graphical Bond head Set-up aid option (GBS) reduces consumable replacement time and ensures a repeatable set-up
  • New Graphical Tooling Set-up aid option reduces tooling set-up time and improves positioning
  • Bond Process Monitoring Option (BPM) helps keep tight control of the bonding process consistency
  • SECS-GEM option for factory automation and communication

General Inquiries

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