Advanced Packaging (APAMA)


Chip-to-Substrate (C2S)

The APAMA Chip-to-Substrate (C2S) offers fully Automated solution for Thermo-Compression Bonding (TCB), High Density Fan-Out Wafer Level Packaging (HD FOWLP) and High Accuracy Flip Chip (HA FC).

Cost-of-Ownership Advantage

Modular designs allow the flexibility of upgrading from HD FOWLP or HA FC to TCB processes enabling effective cost-of-ownership and preserving the investments of our customers.
C2S Features & Benefits:
  • Automation
  • Control
  • Placement Accuracy
  • Performance
  • Yield Enhancement
  • Adaptability
  • Cost-of-Ownership Advantage
Enterprise & Consumer Applications
  • Network Routers and Switches
  • Servers
  • High-end PCs and Graphics
  • Smartphones and Tablets

General Inquiries

We are here to help. Please complete the inquiry form and we will direct you to the right team.