Advanced Solutions (Hybrid)

Hybrid FC/DA

The Hybrid combines high-accuracy Flip Chip bonding directly from wafer with ultra-high-speed chip shooting.
  • Accuracy up to 7 µm CpK > 1.0
  • Ultra-low placement defect levels; below 1 dpm
  • Output up to 140 K
  • 0201m/008004 capability
  • Placing thin components without cracking
  • Full control of your process
  • Full traceability

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