A single machine solution for WLP manufacturing. Flip Chips, Bare dies or SMD’s can be mounted on wafers up to 300 mm or panels up to 800 mm length.
- Accuracy up to 7 µm CpK > 1.0
- Ultra-low placement defect levels; below 1 dpm
- Output up to 165 K
- 0201M/008004 capability
- Placing thin components without cracking
- Full control of your process
- Full traceability