The Hybrid combines high-accuracy Flip Chip bonding directly from wafer with ultra-high-speed chip shooting.
- Accuracy up to 7 µm CpK > 1.0
- Ultra-low placement defect levels; below 1 dpm
- Output up to 140 K
- 0201m/008004 capability
- Placing thin components without cracking
- Full control of your process
- Full traceability