Advanced Packaging (Hybrid)

Hybrid High Accuracy

A single machine solution for WLP manufacturing. Flip Chips, Bare dies or SMD’s can be mounted on wafers up to 300 mm or panels up to 800 mm length.
  • Accuracy up to 7 µm CpK > 1.0
  • Ultra-low placement defect levels; below 1 dpm
  • Output up to 140 K
  • 0201m/008004 capability
  • Placing thin components without cracking
  • Full control of your process
  • Full traceability

General Inquiries

We are here to help. Please complete the inquiry form and we will direct you to the right team.